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DAOS-17045 bio: drain inflight health collecting on teardown (#15884) #15922

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merged 1 commit into from
Feb 19, 2025

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When teardown a faulty device, ensure the inflight health collecting NVMe command completed before putting the io channel & open descriptor for health monitor.

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When teardown a faulty device, ensure the inflight health collecting
NVMe command completed before putting the io channel & open descriptor
for health monitor.

Signed-off-by: Niu Yawei <yawei.niu@hpe.com>
@NiuYawei NiuYawei requested review from a team as code owners February 18, 2025 01:51
@NiuYawei NiuYawei added the clean-cherry-pick Cherry-pick from another branch that did not require additional edits label Feb 18, 2025
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Ticket title is 'server segfault on aurora with spdk'
Status is 'In Review'
Labels: 'ALCF,alcf_track'
https://daosio.atlassian.net/browse/DAOS-17045

@NiuYawei NiuYawei requested a review from a team February 19, 2025 00:49
@gnailzenh gnailzenh merged commit c5a567c into release/2.6 Feb 19, 2025
57 checks passed
@gnailzenh gnailzenh deleted the niu/release-26/DAOS-17045 branch February 19, 2025 07:16
@mjmac mjmac mentioned this pull request Mar 18, 2025
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4 participants